Chiplet integration engineer - Hsinchu,

仅限注册会员 Hsinchu,, 台湾

1个月前

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Job Description · Familiar to 2.5D or 3D PKG integration & development & mass production experience · From chip architecture view to propose best-fit PKG technology with SIPI, testing, thermal consideration · Requirement · Understanding TSMC, INTEL, OSAT 2.5D PKG technology · Und ...
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