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    PLP- Advanced Packaging R&D Engineer - Taipei, 台湾 - Career Wise

    Career Wise
    Career Wise Taipei, 台湾

    发现在: Manatal GBL S2 T2 - 1天前

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    描述

    As a PLP - Advanced Packaging R&D Engineer, you will be responsible for driving research and development initiatives focused on advancing PLP back-end processes, equipment, and material technologies. Your role will involve conducting evaluations of new products and integrating cutting-edge technologies to enhance our advanced packaging solutions.

    Key Responsibilities:

    1. PLP Back-end Process/Equipment/Material Technology Development:
      • Lead R&D efforts to develop and optimize PLP back-end processes including wafer grinding, wafer cutting, laser cutting, ball mounting, die bonding, molding, and laser marking.
      • Collaborate with cross-functional teams to identify areas for improvement and develop innovative solutions to enhance process efficiency, yield, and reliability.
      • Evaluate and implement advanced equipment and materials to stay at the forefront of technology in the semiconductor packaging industry.
      • Conduct feasibility studies and process simulations to assess the viability and scalability of new technologies and processes.
    2. New Product Evaluation and Integrated Technology Development:
      • Evaluate new products and materials for compatibility with existing processes and equipment.
      • Drive integrated technology development initiatives to incorporate new advancements into our packaging solutions.
      • Collaborate with product development teams to ensure the successful integration of new technologies into product designs.
      • Conduct thorough testing and validation of integrated technologies to ensure performance and reliability meet or exceed industry standards.

    Qualifications:

    • Bachelor's degree in Engineering, Materials Science, or related field; Master's or Ph.D. preferred.
    • years of experience in semiconductor packaging R&D, with a focus on back-end processes and equipment development.
    • In-depth knowledge of PLP back-end processes including wafer grinding, cutting, bonding, molding, and marking.
    • Experience with advanced packaging materials, equipment, and technologies.
    • Strong analytical and problem-solving skills with the ability to drive innovation and continuous improvement.
    • Excellent communication and collaboration skills, with the ability to work effectively in cross-functional teams.
    • Proven track record of successfully leading R&D projects from conception to implementation.
    • Experience with technology transfer and scale-up from R&D to production is desirable.
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