Chip Packaging Technologist, Cloud - Zhubei

仅限注册会员 Zhubei, 台湾

1个月前

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全职
Minimum qualifications: · Bachelor's degree in Materials, Mechanical, Electrical Engineering, a related field, or equivalent practical experience. · 5 years of experience in working with 3D packaging. · 5 years of experience in working with foundries and OSATs for package develop ...
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