Staff Advanced Packaging Engineer - Hsinchu
6天前
Job summary
We are looking for a highly motivated packaging engineer capable of leading state-of-the-art advanced IC packaging technology development and new product introduction(NPI) of leading-edge package technologies for Mobile, Automotive, IOT, High Performance Computing and new emerging markets and driving that innovation into high volume manufacturing at OSATs.
Extensive knowledge and experience are required in bumping,
waver level package (WLP), fan-out wafer level package (FOWLP), fan-out panel level package (FOPLP)
,and 2.5D RDL process, materials,equipment,reliability,and design rules.
The position also requires the ability to lead multi-functional teams
and solve complex technical problems in working with multiple OSATs.
职位描述
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