封裝技術工程師 - Hsinchu

仅限注册会员 Hsinchu, 台湾

3周前

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【工作內容】 · 產品 NPI 階段於封裝製程的工程可行性評估 · 產品 Qualification 於外包的封裝製程的相關 follow up · 封裝 issue 的 debug & 發生excursion 時的 trouble shooting · 新製程, 新材料, 新 package 的評估 · 【條件要求】 · 學歷要求:學士以上 · 科系要求:物理, 化工, 化學, 材料, 電子, 電機, 工業工程 · 相關經驗:封裝製程 5 年以上 · 語言能力:[英文] 聽: 精通, 說: 精通, 讀: 精通, 寫: 精通 · 管理責任:無 · 輪班需 ...
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