IC Packaging Substrate Engineer_ Staff - Hsinchu
1周前
Job Overview:
Qualcomm Packaging group is responsible for developing new package technologies and high-volume manufacturing deployment for different product segments for mobile market & new emerging markets for AI, IoT, Automotive.
This team is responsible for roadmap, working with OSATs, IC substrate suppliers, internal design and product teams as well as NPI.
职位描述
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