Technology Engineer(3.5D methodology) - Hsinchu,

Are you looking to power the next leap in the exciting world of advanced electronics? Do you want to help solve problems that drive success in the rapidly evolving technology and connectivity landscape? Then bring your problem-solving, passion, and creativity to help us power the ...

Are you looking to power the next leap in the exciting world of advanced electronics? · Do you want to help solve problems that drive success in the rapidly evolving technology and connectivity landscape? Then bring your problem-solving, passion, and creativity to help us power t ...

Develop 3.5D methodology from RTL to GDS and Package. · ...

This strategic technology leadership position will have tremendous visibility within the company setting the strategic direction for the semiconductor advanced 2.5D/3D packaging and Advanced 3D-IC segment across Entegris. · In this role you will: Develop and drive the corporate a ...

Advanced packaging technology development engineer/ manager responsible for new product introduction technology development and advanced chiplet and 3DIC packaging technology · ...

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. · ...

Develop and maintain audit check sheets for manufacturing processes. · Analyze data to determine areas for improvement and successfully implement solutions. · Collaborate with cross-functional teams to drive continuous improvement initiatives. ...

We are looking for an experienced packaging substrate engineer who has worked on substrate technologies.This IC package substrate engineering role will focus on 2D/2.5D based chiplet technology development and next-generation substrate technologies used in advanced semiconductor ...

This IC package substrate engineering role will focus on 2D/2.5D based chiplet technology development and next-generation substrate technologies used in advanced semiconductor packaging. · The role requires IC substrate fine patterning, small via, new material knowledge and data ...

Qualcomm Packaging group is responsible for developing new package technologies and high-volume manufacturing deployment for different product segments for mobile market & new emerging markets for AI, IoT, Automotive. · This team is responsible for roadmap, working with OSATs, IC ...

We are looking for an R&D Software Engineer to join our world-class engineering team. · ...

We are looking for a highly motivated packaging engineer capable of leading state-of-the-art advanced IC packaging technology development and new product introduction · (NPI) of leading-edge package technologies for Mobile, Automotive, IOT, High Performance Computing and new eme ...

Join a global innovator in consumer electronics known for design excellence. Lead CMF innovation from concept to mass production. · ...

Drive growth in advanced semiconductor inspection markets Engage clients with cutting-edge 3D measurement technologies About Our Client Our client is a global technology company specializing in precision measurement and inspection solutions for the semiconductor and electronics m ...

We seek talented engineers to join us. · MS in computer science or related areas15+ years of experience in computing, networking, or cloud managementSecurity by design... ...

Job Summary: · We are looking for a highly motivated engineer with strong embedded system development experiences and a solid understanding of DDR/DRAM technology and high-speed I/O concepts. · In this role you will validate DDR memory systems through firmware and driver integrat ...

+High-speed SerDes system technology development (200Gbps+) including electrical and optical communications. · +Define system technical specifications · Discuss system architecture with design teams · Establish models for simulation and evaluation · ++Master's degree in Electrica ...

We are looking for highly talented individuals to join our cutting-edge technology work By joining our team,you'll collaborate with world-class engineers to create innovative solutions that push the limits of performance, · energy efficiency,and scalabilityIC top level floorplann ...

+ As a Manufacturing Manager you will be working closely with the Graphcore Design and Test Engineering teams, Quality and Supply Chain Management in support of NPI development and volume production. · +Provide DFMA feedback during product development phases to ensure good manufa ...

Join us to deliver material innovation that changes the world. · Design, collect data, analyze, and compile reports on difficult process engineering experiments · Perform hardware characterization on a variety of difficult systems · ...